http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S61203141-A

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filingDate 1985-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13ea52b59e3fa7d47d9106a5d5d7ff8c
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publicationDate 1986-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S61203141-A
titleOfInvention Production of phenolic resin laminate
abstract PURPOSE: To obtain the title laminate having low-temperature punchability, by drying a priming resin-impregnated cellulose substrate by heating, impregnat ing the substrate with a top-coating phenolic resin, laminating the resulting prepregs and curing the resins. n CONSTITUTION: 100 pts.wt. phenolic resin(A), formaldehyde(B) and 5W30 pts.wt. at least one member(C) selected from among arom. amines (e.g. trimethylamine) and arom. amides (e.g. p-toluene-sulfonamide) are co-condensed. Alternatively, a phenolic resin obtd. by reacting component A with component B is mixed with component C to obtain a priming resin. A cellulose substrate (e.g. kraft paper) is impregnated with 5W20wt% said priming resin and dried by heating. The impregnated substrate is impregnated with a topcoating phenolic resin in a quantity of 50W60wt% based on the combined quantity of the priming resin and the phenolic resin, to obtain a prepreg. A plurality of the prepregs are laminated, and optionally, a copper foil is laminated thereon. The laminate is pressed and heated to cure the resins, thus obtaining the title laminated. n COPYRIGHT: (C)1986,JPO&Japio
priorityDate 1985-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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