| abstract |
PURPOSE: The titled phenolic resin which is excellent in flexibility and can be applied to an adherend by a simplified adhesion or coating process, obtained by forming a specified resin composition reacted or mixed with a linear polymer into a film and heat-treating this film. n CONSTITUTION: A phenolic resin composition comprising 100pts.wt. novolak or resol phenolic resin obtained by reacting a phenol with HCHO with the aid of an acid and alkali and 1W500pts.wt. linear polymer [e.g., (un)saturated polyester] for imparting flexibility is formed into a film of a thickness of several μ W several thousands μ and heat-treated at 50W250°C for several min W several tens min to obtain a film or sheet having the desired degree of curing and being excellent in heat resistance, electrical properties and resin properties. n COPYRIGHT: (C)1986,JPO&Japio |