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filingDate 1985-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_567372db6df3a953cf93927bc950ae45
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publicationDate 1986-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S61163946-A
titleOfInvention Resin composition for extrusion lamination
abstract PURPOSE: To retain high adhesion to various substrates without using any anchoring agent and to improve moldability and heat sealability, by adding a specified copolymer to an ethylene/maleic anhydride copolymer. n CONSTITUTION: An epoxy group-contg. ethylene copolymer (A) and/or a copoly mer (B) obtd. by partially (degree of neutralization of 10W70mol%) ion- crosslinking a copolymer mainly composed of ethylene and an unsaturated carboxylic acid and/or its derivative, are/is mixed with an ethylene/maleic anhydrice copolymer (C). The mixing ratio is such that the combined quantity of the epoxy group and the metallic ion in component A and/or B is 1/2,000W1/10mol equivalent based on the quantity of maleic anhydride in the copolymer C. The copolymer A is a copolymer of ethylene with an unsaturated glycidyl compd. (e.g. glycidyl acrylate). Examples of the unsaturated carboxylic acids in component B are monoesters of acrylic and maleic acids. n COPYRIGHT: (C)1986,JPO&Japio
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Total number of triples: 31.