http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S61145221-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f6e960aa6ad2ba6401030159343ebe68 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
filingDate | 1984-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad1e15c27a67117dcba11abf710aa31a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b71db947fe5191e10098c4d2a403b885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a89f821610f0f053bc5a41379a66a07e |
publicationDate | 1986-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-S61145221-A |
titleOfInvention | Production of highly pure epoxy resin |
abstract | PURPOSE: To obtain the title resin which can give laminates excellent in soldering-heat resistance, by reacting a low-MW epoxy resin with a polyphenol in the presence of a catalyst and treating the product with an aqueous liquid. n CONSTITUTION: A high-MW epoxy resin is obtained by reacting a low-MW epoxy resin [e.g., 2,2-bis(4-hydroxyphenyl) propane diglycidyl ether] with a polyphenol[e.g., 2,2-bis(4-hydroxy-phenyl) propane] at 120W200°C in the presence of 0.0001W10wt.%, based on the low-MW epoxy resin, catalyst (e.g., NaOH) in, optionally, a solvent (e.g., xylene). This high-MW epoxy resin is dissolved, if required, in a solvent and contacted with an aqueous liquid which is water or an aqueous salt solution of a pH of 4W9 (e.g., aqueous solution of NaH 2 PO 4 ) at room temperature W150°C to obtain a highly pure epoxy resin. n COPYRIGHT: (C)1986,JPO&Japio |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009221487-A |
priorityDate | 1984-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.