http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S61127768-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
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filingDate 1984-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fb85c5a4540a2863238af22cab3999e
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publicationDate 1986-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S61127768-A
titleOfInvention Epoxy resin composition
abstract PURPOSE: The titled composition, consisting of an acrylic or methacrylic acid- modified epoxy resin, epoxy resin, Al compound, specific silicon compound and polyvinylacetal, and capable of giving cured articles having improved adhesive property, flexibility, transparency and surface smoothness. n CONSTITUTION: An epoxy resin composition consisting of (A) an acrylic or methacrylic acid-modified epoxy resin, preferably a reaction product of an epoxy resin expressed by the formula with (meth)acrylic acid, (B) an epoxy resin, preferably novolak phenolic resin-modified epoxy resin, (C) an Al compound, preferably trisethylacetoacetatoaluminum compound, (D) a silicon compound having peroxysilyl group, preferably tri-phenyl-tert-butylperoxysilane and (E) polyvinylacetal, preferably polyvinylbutyral resin having 60W75mol% butyral groups and ≤3wt% volatile content. n COPYRIGHT: (C)1986,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08239621-A
priorityDate 1984-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 25.