| abstract |
PURPOSE:To improve the bonding strength of wirings and the reliability by securing a semiconductor chip onto a metal frame, and wire connecting the external connecting terminal with a metal aluminum layer by wirings. CONSTITUTION:A metal foil 1 on a hoop made or iron-nickel alloy is continuously punched by a die to form a metal frame having desired pattern, and a metal aluminum layer 2 is partly formed on the frame. Nickel plating is thinly formed on the metal foil, aluminum is partly precipitated by a vacuum depositing method to improve the bondability between the layer 2 and the foil 1. A die bonding is treated, the external connecting terminal of a semiconductor chip 3 and the layer 2 are connected by fine metal wirings 4 of gold or aluminum wirings by a thermal press-bonding or supersonic wave method, the chip 3 is then sealed with molding resin 5 to form a semiconductor package. Thus, when aluminum wirings are used, the bonding strength is excellent, and the reliability of connection is improved. |