http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S61118463-A

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filingDate 1984-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66ed593b817d7d7931c336a82ad813b6
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publicationDate 1986-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S61118463-A
titleOfInvention Epoxy resin varnish for production of laminated board
abstract PURPOSE: To provide the titled varnish having improved storage stability, moldability in lamination molding, and heat-resistance of the laminated product, by adding an organic acid to a varnish obtained by compounding an epoxy resin with a hardener. n CONSTITUTION: The objective varnish can be produced by dissolving (A) an epoxy resin and (B) a hardener (e.g. dicyandiamide) in a solvent, and adding (C) an organic acid (e.g. oleic acid) to the obtained epoxy resin varnish. The amount of the component C is preferably 0.001W0.1wt% based on the varnish except for the solvent component. n COPYRIGHT: (C)1986,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H01201339-A
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type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.