| abstract |
PURPOSE:To obtain a photosensitive resin composition having high sensitivity, resolution and dry etching resistance and suitable for use as a resist for manufacturing a semiconductor element by blending a specified siloxane polymer with a bisazido compound and a sensitizer. CONSTITUTION:A siloxane polymer (A) represented by the formula (where each of R, R' and R'' is H, alkyl or phenyl, and each of l, m and n is 0 or an integer) is blended with a bisazido compound (B) such as 3,3'-dichloro-4,4'-diazidodiphenylmethane and a sensitizer (C) such as benzoin methyl ether or azobisisobutyronitrile to obtain the desired photosensitive resin composition. The siloxane polymer represented by the formula is prepd. by polymerizing cyclic phenylsiloxane such as hexaphenylcyclotrisiloxane by ring opening in the presence of alkali and by hydroxylating the resulting polydiphenylsiloxane. |