| abstract |
PURPOSE:The titled composition useful for moisture-resistant electrical insulation of hybrid IC, having improved adhesivity to substrates, and humidity resistance, comprising a reaction product of a specific adduct of maleic anhydride and hydroxy (meth)acrylate, a specified silane, and a photopolymerization initiator. CONSTITUTION:The desired composition obtained by blending (A) 100pts.wt. compound obtained by adding maleic anhydride to a vegetable oil having a double bond capable of being added to maleic anhydride to give a compound, reacting this compound with a compound (e.g., 2-hydroxyethyl methacrylate, etc.) shown by the formula I (R1 and R2 are H, or CH3), (B) 5-40pts.wt. compound [e.g., methyltri(methacryloyloxyethoxy)silane, etc.) shown by the formula II (R3 is H, or CH3; R4 is bifunctional hydrocarbon group; R5 is alkyl), (C) 0.5- 20pts.wt. compound (e.g., gamma-methacryloxypropyltrimethoxysilane, etc.] shown by the formula III and/or formula IV (R6 is H, or CH3; R7 is bifunctional hydrocarbon residue; R8 is alkyl), and (D) 0.001-10pts.wt. photopolymerization initiator (e.g., benzyl methyl ketal, etc.). |