| abstract |
PURPOSE:To obtain a pattern faithful to a resist pattern by coating a specified photosensitive silicone resin composition on a layer to be processed, forming a pattern by exposure and development, and carrying out dry etching with oxygen plasma. CONSTITUTION:A photosensitive silicone resin composition 3 consisting of ladder polysiloxane having optionally terminal hydroxy groups represented by formula I and/or II [where each of R1-4 is a univalent (substituted) hydrocarbon group, and each of m and n is a positive integer] and an aromatic (sulfonyl) azide compound is dissolved in an org. solvent. The composition 3 is coated on a layer 2 to be processed such as an insulating layer on a substrate 1, and it is dried, irradiated with light, and developed to form a patterned resist layer 3. The layer 3 is exposed to oxygen plasma to dry etch the part of the layer 2 not covered with the layer 3, and the layer 3 is removed. Dry etching is easily applied, and a fine circuit pattern can be formed. |