http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S60245233-A

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-318
filingDate 1984-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91756eb19d706fa167421015acae4932
publicationDate 1985-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S60245233-A
titleOfInvention Manufacture of semiconductor device
abstract PURPOSE:To increase sufficiently treating ability and to form uniformly a titanium nitride film with uniform quality over a semiconductor substrate surface, by employing titanium tetrachloride and ammonia as principal raw materials. CONSTITUTION:Into the reacting chamber 12 in which a reacting gas introducing conduit 11 in T-shape is mounted at the central section, vapor of titanium tetrachloride and ammonia gas and nitrogen gas as a carrier gas, being mixed, are introduced through the conduit 11. In the reacting chamber 12 which is kept at a pressure of about 0.3-0.5Torr by exhausting means 15 and at a temperature of 500-650 deg.C, a titanium nitride film is deposited over each of surfaces of semiconductor substrates 14. In this way, by employing liquid titanium tetrachloride with a sufficiently high vapor pressure and ammonia gas as principal materials, the reduced pressure vapor phase epitaxy apparatus which has been employed usually and previously, can be utilized to form a titanium nitride film, so that sufficiently many substrates can be treated.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5300321-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1641031-A3
priorityDate 1984-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 22.