| abstract |
PURPOSE:To obtain a negative type resist capable of undergoing dry treatment of a substrate and microfabrication with high resolution and high precision by incorporating a silicon-contg. resin having aromatic rings each having specified substituents on a part or the whole part of the ring, in a photosensitive resin compsn. CONSTITUTION:The silicon-contg. resin may be either of a polysiloxane or polysilane resin, and a polymer of phenylmethylsiloxane, etc., are used for an aromatic polysiloxane resin, and polydiphenylsilane, etc., are used for the polysilane resin. These resing having -CH2N3 group are used alone or together with a a sensitizer, such as aromatic ketones, and a cross-linking agent, such as divinyl compds., etc., as a photosensitive resin. Said sensitizer is used generally in an amt. of 3-20wt% of the silicon-contg. resin, and said cross-linking agent is used 5-25wt% of said resin. They are dissolved in a solvent, applied to the substrate, exposed, and developed to form a pattern. This pattern is used as a mask for treating the substrate to be microprocessed. |