| abstract |
PURPOSE:To enhance reliability of action under high temperature and high moisture by a method wherein a semiconductor device is sealed with a resin composite containing organic carbon acid compound in an effective amount less than the amount of exhibiting the effect of hardener. CONSTITUTION:Malonic acid, n-butylmalonic acid, aconitic acid, acetylene dicarboxylic acid, glyoxyl acid, oxamide acid, maleic acid, trimellitic acid, pyromellitic acid, and a kind of organic carbon acid of these acid anhydrides or an acid anhydrides is added in an effective amount less than the amount of exhibiting the effect of hardener, to a compound with the addition of novolak type phenol resin to epoxy resin as the hardener, triphenylphosphine as the hardening promotor, epoxy silane as the coupler, fused quartz glass powder and hydrophobic silica powder as the fillers, repsectively; then, the whole is heated and kneaded. The semiconductor device is resin-sealed with a composite produced by cooling and rough grinding. |