| abstract |
PURPOSE: A photocurable resin composition excellent in adhesion to substrates, especially, to the surface of metal or glass, prepared by adding a specified organic compound and a photopolymerization initiator to a polyfunctional epoxy compound. n CONSTITUTION: Use is made of a urea compound of the formula (wherein R 1 and R 2 are each a 1W10C alkyl, 1W10C alkenyl, a 6W8C aryl, or a 7W9C aralkyl or R 1 and R 2 may be combined together to form a ring, X and Y are each H, a halogen, methyl, methoxy or nitrol) and a like compound. Namely, 100pts.wt. epoxy compound (e.g., bisphenol A-derived epoxy resin) is mixed with 10W300pts.wt. at least one compound selected from among a compound having at least two polymerizable unsaturated groups and a compound having an epoxy group and a polymerizable unsaturated group (e.g., ethylene glycol), 0.3W1.5pts. wt. organic acid hydrazide compound (e.g., salicylic acid hydrazide), 0.3W10pts. wt. above urea compound (e.g., 3-phenyl-1,1-dimethylurea), and 0.5W20pts.wt. photopolymerization initiator. n COPYRIGHT: (C)1985,JPO&Japio |