| abstract |
PURPOSE: To obtain a resin composition of high electrical conductivity capable of molding processing, by dissolving a specific amount of metal salt in a polymer from specific monomer and another polymerizable vinyl monomer. n CONSTITUTION: The objective composition can be obtained by dissolving in a polymer prepared from (A) 31W100wt% of a monomer of formula (R 1 is H, methyl, or CH 2 COOC n H 2n OR 2 ; R 2 is H or 1W4C hydrocarbon; n is 2W4) (e.g., 2-hydroxyethyl acrylate) and (B) 0W69wt% of a polymerizable vinyl monomer (e.g. alkyl acrylate) (C) a metal salt (e.g. hydrohalogenic acid alkali metal salt, thiocyanic acid one) in such an amount as to be 0.01W1g equivelent per hydroxyalkyl or alkoxyalkyl group in said polymer. n COPYRIGHT: (C)1985,JPO&Japio |