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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
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filingDate 1984-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de9d94eaa333e371349a24ff35739f1b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41d7b9e1998af4f20ec83a078e328a6a
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publicationDate 1985-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S60170623-A
titleOfInvention Epoxy resin composition
abstract PURPOSE: The titled composition, obtained by incorporating a compound having epoxy group and an unsaturated bond, an isocyanurate derivative having an unsaturated bond in the side chain and a curing agent in an epoxy resin, having a short surface drying time and capable of giving cured articles having improved heat resistance. n CONSTITUTION: A resin composition obtained by incorporating (A) 10W100pts.wt. compound having epoxy group and an unsaturated bond, e.g. glycidylmethacrylate, (B) 20W500pts.wt. isocyanurate derivative expressed by the formula (at least one of R 1 , R 2 and R 3 is an optional substituent group having an unsaturated bond), e.g. tris(acryloyloxyethyl)isocyanurate, and (C) 0.1W10pts.wt. curing agent, e.g. tetrahydrophthalic anhydride or amine, in (D) 100pts.wt. epoxy resin, e.g. diglycidyl ether of bisphenol A. n COPYRIGHT: (C)1985,JPO&Japio
priorityDate 1984-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 38.