http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S60168717-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 |
| filingDate | 1984-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca64f2f32bd2822d6580638d32e31116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a7764c23bb42194e049ca5418abe553 |
| publicationDate | 1985-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S60168717-A |
| titleOfInvention | Latent curing agent for epoxy resin |
| abstract | PURPOSE: The titled latent curing agent excellent in low-temperature rapid curability and storage stability, comprising a specified hydrazide. n CONSTITUTION: Thiodipropionic acid (methyl ester) is reacted with hydrazine hydrate to obtain a latent curing agent for epoxy resins, comprising a hydrazide of formula I or II. An epoxy resin is mixed with 0.5W1.5 equivalent (in terms of active hydrogen equivalent) of above latent curing agent per equivalent of the epoxy groups of the epoxy resin, and optionally, other curing agents, a cure accelerator, filler, etc. and the mixture is cured by heating at 120W140°C to obtain a tough cured product of excellent heat resistance. n COPYRIGHT: (C)1985,JPO&Japio |
| priorityDate | 1984-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.