| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a07d0b3e3169dd026ecd9113fc9cc4ad |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15747
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate |
1984-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e064c425ce3c4842dc7497edef492c5f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5de22b293dd5cb649014039ec35748e3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d49fe9459d7f6b26590ec0d294331e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14c5560c05b59a935083aa9f41c32403 |
| publicationDate |
1985-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-S60147147-A |
| titleOfInvention |
Lead frame for semiconductor device |
| abstract |
PURPOSE:To realize a highly reliable and economically superior lead frame made of Cu or a Cu alloy of high thermal conductivity for a semiconductor device by a method wherein an intermediate layer of a Cu-Zn or Cu-Sn alloy is sandwiched between a primary layer of Ni and an Ag layer. CONSTITUTION:Prior to the manufacture of a lead frame for a semiconductor device, a substrate 1 made of Sn-containing Cu with desired pattern punched through is subjected to degreasing and acid bath, whereafter the entire surface is coated by a primary Ni layer 2 formed by plating. A region 5 whereto a semiconductor element is fixed and internal lead terminal 6 positioned at the end of an external lead terminal 7 are coated by an approximately 0.1mum-thick Cu-Zn alloy layer 3 and then by an Ag layer 7 by plating, for the realization of a lead frame of a cross section of the specified construction. This method results in an inexpensive Cu-based lead frame with an excellent heat-dissipating capability without degrading affinity with a sealing resin and Ag coating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6593643-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6759142-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6939621-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1281789-A1 |
| priorityDate |
1984-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |