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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-34
filingDate 1983-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51e5a4090c036bd9a9c20ec70242b68c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60d44c2f4c5729418c73e00f8aed4ca6
publicationDate 1985-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S60120752-A
titleOfInvention Heat-resistant resin composition
abstract PURPOSE: To provide the titled compsn. for forming heat-resistant films, excellent in storage stability and containing a high concn. of resin, by incorporating a small amt. of melamine(derivatives) in a particular polyamide-imide resin terminated with alcohol and dissolving in solvents. n CONSTITUTION: Preferably in an org. solvent (e.g., N-methyl-2-phrrolidone), a polyfunctional isocyanate (e.g., diphenylmethane diisocyanate) and a tribasic acid anhydride(derivative) (e.g., trimellitic anhydride) are allowed to react to form a heat-resistant resin with reduced viscosity of 0.1W0.4. About 1W3wt% alcohol (e.g., methanol or butanol) is added to 100wt% said resin, and the mixture is allowed to react at a temp. above about 40°C for about 0.1W20hr to block the terminal isocyanate. Then, about 0.1W0.9pts.wt. melamin(derivative) (e.g., monomethylolmelamine) is added to 100pts.wt. above resin, and the mixture is diluted with a proper amt. of a solvent, yielding a heat-resistant resin compsn. n COPYRIGHT: (C)1985,JPO&Japio
priorityDate 1983-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 34.