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filingDate 1983-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa3b297f2f10023d24f93ebc68af9e53
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publicationDate 1985-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S60118747-A
titleOfInvention Conductive composition containing copper
abstract PURPOSE: To obtain a composition of high storage stability and electrical conductivity, developing no rust on the surface of cured products, by incorporating a formulation containing copper powder as conductive material with o-aminophenol, 2,2'-dipyridyl, and/or 2,2'-diquinolyl. n CONSTITUTION: The objective composition can be obtained by incorporating a formulation made up of (A) 50W98 (pref. 70W93) wt%, based on the final composition, of copper powder (e.g. reduced one, electrolytically deposited one, with a size ≤300μm pref. 1W100μm) and (B) resin binder (curing matter having function as binder; e.g. styrene resin) with, as additive(s) (C) 0.001W0.3 (pref. 0.005W0.1) pt.wt. per pt.wt. of the copper powder, of at least one sort of compound selected from o-aminophenols (e.g. 2-amino-4-nitrophenol), 2,2'-dipyridyls (e.g. 2,2'-dipicolyl) and 2,2'-diquinolyls. Said additive(s) may be incorporated in the form of an organic solvent solution. n COPYRIGHT: (C)1985,JPO&Japio
priorityDate 1983-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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