| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-02216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-02325 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate |
1983-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0b26c243524816c0939fecb24931cf8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_041f615f72c09df39fa028aa3b428d60 |
| publicationDate |
1985-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-S60110185-A |
| titleOfInvention |
Optical integrated circuit package |
| abstract |
PURPOSE:To improve the thermal dissipation, to increase the lifetime and to enhance the reliability by composing of the first package metallized from terminal lead wirings and the second package made of a solid piece having large thermal conductivity on a ceramic substrate. CONSTITUTION:Lead wirings 4 connected with external leads 3 are metallized on a ceramic substrate 1 formed with a recess, internal leads 5 are connected as the first package, the projection 11 of the second package made of metal piece 10 of a copper material is coupled with epoxy resin with the recess and integrated. An Si submount 21 is die bonded along the projection 11 and then an optical integrated circuit chip 20 integrated with the semiconductor laser and the drive circuit are die-bonded, electrode pads 23 of the chip 20 and the leads 5 are wire bonded with wirings 22. The heat generated at the chip 20 is transmitted to the piece 10 having large thermal conductivity, thereby improving the heat dissipation. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-02054118-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010182800-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-02054118-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6888860-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1220390-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0571907-A3 |
| priorityDate |
1983-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |