http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S60108839-A

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filingDate 1983-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a13215a0c6407bc80d177c297a3eea49
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publicationDate 1985-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S60108839-A
titleOfInvention Photosensitive heat resistant material
abstract PURPOSE:To enable fine working direct light and to simplify process by forming a titled material of specific organoladder polysiloxane and bis-silyl compd. and photosensitizer. CONSTITUTION:A titled material is formed of the organoladder polysiloxane obtd. by bringing the organoladder polysiloxane expressed by the formula I which is terminal hydroxylader type organopolysiloxane and the unsatd. compd. expressed by the formula II into reaction in an org. solvent as well as bis-silyl compd. and photosensitizer. The organoladder polysiloxane and the unsatd. compd. are mixed at a ratio of 1-3 alkoxy groups of the unsatd. compd. with one hydroxyl group of the organoladder polysiloxane. Such heat resistant photosensitive material is coated on a silicon wafer or the like and light or radiations are irradiated through a mask having a prescribed pattern thereto, then the material is developed by an arom. hydrocarbon solvent or the like, then the unexposed part is washed away and the relief pattern having a sharp end face is obtd. In the formulas, R1-R3 are lower alkyl groups such as a methyl group and a propyl group, X is a hydrogen atom, methyl group, etc., l is 1-3, n is 2-100.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001026717-A
priorityDate 1983-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.