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filingDate 1983-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e543a88528c4ef7bab506591a916c03
publicationDate 1985-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S60106857-A
titleOfInvention Modifier of affinity between organic high-molecular molding material and inorganic compounding agent
abstract PURPOSE: To provide the titled agent which improves the dispersibility of an inorg. compounding agent in an org. high-molecular molding material and imparts improved processability to the resulting molding material, consisting of a specified vinylsilane copolymer resin powder. n CONSTITUTION: The titled modifier is composed of a vinylsilane copolymer resin powder obtd. by powdering an aq. emulsion contg. a copolymer obtd. by emulsion-polymerizing a vinylsilane (e.g. γ-methacryloxypropyltrimethoxysilane) and vinyl acetate monomer and/or an acrylic monomer [e.g. butyl (meth)-acrylate] in the presence of an emulsifier (e.g. a polymerizable emulsifier such as an alkali metal saft of an alkyl sulfosuccinate). This modifier can improve the dispersibility of an inorg. compounding agent in an org. high-molecular molding material and has a characteristic of improving the processability of the resulting molding material. n COPYRIGHT: (C)1985,JPO&Japio
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type http://data.epo.org/linked-data/def/patent/Publication

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