http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S598719-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
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filingDate 1982-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42a86da0f036643670caabc2f678de9d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76c9d054ddd1a11664ec7949dc1f48cc
publicationDate 1984-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S598719-A
titleOfInvention Epoxy resin composition
abstract PURPOSE: To prepare the titled composition having excellent curability, heat resistance and moisture resistance, and containing a filler, a cure accelerator, etc., by using a novolak having bisphenol A in the skeleton and represented by the polymer of bisphenol A and formaldehyde, etc. as a curing agent. n CONSTITUTION: The objective composition is prepared by mixing (A) an epoxy resin curing agent containing (preferably accounting for ≥50% of the curing agent) a novolak having bisphenol A in the skeleton and represented by (A) a polymer of bisphenol A and formaldehyde (e.g. the compound of formula I ) or (B) a cocondensation product of bisphenol A, a phenolic compound (e.g. phenol, alkylphenol, resorcinol, etc.) and formaldehyde (e.g. the compound of formula II), with a filler, a cure accelerator, a mold release agent, a surface treating agent, a flame retardant, etc. n USE: Insulating material, protecting material, casing, substrate, etc. of electronic devices. n COPYRIGHT: (C)1984,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S641753-A
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priorityDate 1982-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.