http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S5956419-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-12
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filingDate 1982-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42a86da0f036643670caabc2f678de9d
publicationDate 1984-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S5956419-A
titleOfInvention Mold-releasable phenolic resin and mold-releasable phenolic resin composition
abstract PURPOSE: The titled phenolic resin excellent in mold releasability and code markability and free from mold staining, having releasable functional groups fixed to its skeleton. n CONSTITUTION: A mold releasable phenolic resin or its derivative (an ester compound with a higher alcohol, or a metal salt), obtained by cocondensing (A) a phenol (e.g., phenol, cresol, or resorcinol) with (B) an aromatic hydroxycarboxylic acid (salicylic acid, p-hydroxybenzoic acid, or β-hydroxynaphthoic acid) and (C) an aldehyde (formaldehyde or paraformaldehyde). When this composition is applied to an epoxy resin low-pressure embedding material, one having an aromatic hydroxycarboxylic acid/phenol molar ratio of about 1/5W1/1, and a number-average MW of about 400W700 is preferable. n COPYRIGHT: (C)1984,JPO&Japio
priorityDate 1982-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 46.