| abstract |
PURPOSE: To prepare the titled resin soluble in an inexpensive low-boiling general-purpose organic solvents, and exhibiting excellent heat resistance when cured, by reacting an unsaturated bisimide with a specific diamine under heating. n CONSTITUTION: The objective resin can be prepared by the thermal reaction of (A) a bisimide of formula I (R 1 is bivalent organic group containing C-C double bond; R 2 is bivalent aromatic group containing 1W3 benzene rings) (e.g. N,N'- m-phenylenebismaleimide) with (B) a diamine of formula II (X is O, S, SO 2 , CH 2 , CO, etc.) [e.g. 4,4'-di(p-aminophenoxy)diphenylsulfone] preferably at a molar ratio (A:B) of 1:(0.25W0.8). The reaction is preferably carried out at 120W150°C. n COPYRIGHT: (C)1984,JPO&Japio |