http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S592355-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49548 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate | 1982-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35d7b9f2e2a3d12f0b807a7ee9e302eb |
| publicationDate | 1984-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S592355-A |
| titleOfInvention | Lead frame for semiconductor package and semiconductor device using said lead frame |
| abstract | PURPOSE:To prevent defective plating in the boundary section of an aluminum clad layer, and to ensure the airtight property of the package by making the whole surface of the aluminum clad layer lower than the surface of a frame base material to form a stepped difference in the boundary section, coating a plating section while crossing the stepped difference section from the upper section of an aluminum clad and sealing a semiconductor element with glass. CONSTITUTION:The inner lead section 1 of the lower section of an aluminum clad layer 4 is made lower than the surface of the frame base material of an outer lead section 2, and the stepped difference 6 is formed in the bondary section of the aluminum clad layer 4. A plating layer 11 in gold, etc. is formed onto the outer lead section 2 under the state in which the outer end section of a silicon rubber 7 is conformed to the inner surface of the stepped difference 6 and the surface and back of the inner lead section 1 are convered with a plating mask jig 10. A ceramic base 12 is joined with the lower surface of the lead frame 3 by low melting-point glass 13, and the semiconductor element 15 is loaded onto the base, an sealed through low melting-point glass 18 by a ceramic cap 17. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5463248-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6122267-A |
| priorityDate | 1982-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.