http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S59223746-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-00 |
| filingDate | 1983-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b32bda53a45cc11c26e3eb8b3db2965 |
| publicationDate | 1984-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S59223746-A |
| titleOfInvention | Phenolic resin molding material for substrate to be plated |
| abstract | PURPOSE: To provide the titled material for a substrate which can be directly electroplated without requiring any chemical plating stage, by adding specified quantities of an electrically conductive material and rubber. n CONSTITUTION: 3W10% (based on the quantity of molding material) rubber, pref. nitrile rubber, and an electrically conductive material, e.g. metallic powder, carbon black or graphite, in a sufficient quantity to make the volume resistivity of molding 10 3 Ωcm or below, are mixed with a phenolic resin compsn. consisting of a resol type phenolic resin (a novolak type phenolic resin may be used together with a hardener such as hexamethylenetetramine), a filler, e.g., woodmeal or calcium carbonate, and a parting agent, e.g., wax or metallic soap, to obtain a phenolic resin molding material for a substrate to be plated. n COPYRIGHT: (C)1984,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0218490-A |
| priorityDate | 1983-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.