http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S59221328-A

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filingDate 1983-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e4c8bd62a660afcfd09ff59091786f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7adf99af3c46ce13a1bf11ce2ccba273
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_117f57fbee57fbdf9609473134d964eb
publicationDate 1984-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S59221328-A
titleOfInvention Manufacture of thermally cured polyimide
abstract PURPOSE: To obtain a thermally cured polyimide useful as a thermosetting material, suppressing the reaction of the by-products, by reacting a polyamidic acid at a high temperature using an aliphatic acid anhydride as a dehydrative cyclization agent for the polyamidic acid. n CONSTITUTION: The objective polyimide can be produced by (1) reacting (A) a polyamine of formula R-(NH 2 ) n (R is ≥2C organic group; n≥2) (e.g. m-phenylenediamine, 4,4'-diaminodiphenylmethane, etc.) with (B) ≥0.95 moles, based on 1 mole of the NH 2 group of said polyamine, of an aliphatic carboxylic acid anhydride containing double bond or its derivative (e.g. maleic anhydride, itaconic anhydride, etc. its halogen-substituted product, etc.), (2) reacting the resultant polyamidic acid with (C) a fatty acid anhydride (e.g. acetic anhydride, succinic anhydride, etc.) at ≥100°C to obtain an imide oligomer mixture containing double bond, (3) mixing 50W100pts. of the obtained oligomer mixture optionally with (D) 0W200pts. of a cure assistant, and (4) heating the obtained mixture at 100W300°C. n COPYRIGHT: (C)1984,JPO&Japio
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