http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S59213720-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f6e960aa6ad2ba6401030159343ebe68
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F16C33-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F16C33-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00
filingDate 1983-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39aeaae3121c599f19cd917c5846af9d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_887166fb93110f0d0507dabb454744f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_843340e452d2158760a16715c8145967
publicationDate 1984-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S59213720-A
titleOfInvention Epoxy resin composition
abstract PURPOSE: To provide a composition capable of molding into sliding members, etc. in any process, comprising an uncured epoxy resin, phenol-novolak resin cured product, urea compound or dicyandiamide compound curing accelerator, and friction-reducing agent. n CONSTITUTION: The objective composition comprising (A) 35W80wt% of an uncured composition prepared by incorporating (i) 100pts.wt. of an uncured epoxy resin (pref. with the terminal epoxy group bonded to O, N, or S; e.g., polyglycidyl ether) with (ii) pref. 20W120pts.wt. of a phenol-novolak resin cured product (pref. constituted by two W five nuclei with a softening point 50W140°C) and (iii) pref. 0.1W10pts.wt. of an urea compound (e.g., 3-phenyl-1,1-dimethyl urea) or dicyandiamide compound (e.g., 2,6-xyleninebiguanide) curing accelerator and (B) 65W20wt% of a friction-reducing agent (e.g., carbon fiber). n COPYRIGHT: (C)1984,JPO&Japio
priorityDate 1983-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S56133856-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S5887123-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226405685
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410566259
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419483880
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID1176
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3283
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16704
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226443571
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7560
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559261

Total number of triples: 35.