| abstract |
PURPOSE:To make it possible to perform wire bonding or soldering without a noble metal layer, by providing a nickel cobalt layer including 0.5-5 weight percent of cobalt on a conductor on a resin substrate. CONSTITUTION:On a phenol substrate 1, a conductor 2 comprising a copper foil having the thickness of about 35mum is arranged. With a Watts bath as a base, cobalt sulfate is added on the conductor 2. A nickel cobalt layer 3 including 0.5-5 weight percent of cobalt is provided on the substrate to the thickness of 3-10mum. The substrate is heated to 180-200 deg.C, and a thin aluminum wire 4 is bonded by ultrasonic waves. |