http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S5920488-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c51f3c17021dd88deab7b36f756a27d1 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60 |
| filingDate | 1982-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84ef671f7397a72849ef028e8c84e0fc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_523cbbc9ce3ee52cf410941b589741aa |
| publicationDate | 1984-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S5920488-A |
| titleOfInvention | Copper-tin alloy plating bath |
| abstract | PURPOSE: To improve the stability of a Cu-Sn alloy plating bath contg. copper cyanide and potassium stannate and to enable uniform bright alloy plating, by adding a thiocyanate, polyethyleneimine and a nickel salt to the plating bath as a brightener. n CONSTITUTION: In a Cu-Sn alloy plating bath contg. copper cyanide and an alkali stannate, potassium stannate is used as the stannate, and to the bath are added a thiocyanate, polyethyleneimine and a nickel salt as a brightener. Thus, a superior Cu-Sn alloy plating bath preventing the precipitation of metastannic acid, having superior stability and enabling uniform bright plating can be obtd. The current density range of the bath for bright plating is extended. n COPYRIGHT: (C)1984,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0768246-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0616119-U |
| priorityDate | 1982-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.