| abstract |
PURPOSE:To prevent the improper connection of bonding wirings in a sealed semiconductor device by forming the end of a pole projected at a stem in a head shape, thereby facilitating the workability. CONSTITUTION:Heading poles 11, 12 are airtightly sealed by iron glass or kovar glass to a stem 10 of iron or kovar covered with gold or nickel plating, and other external lead terminal is brazed or resistance-welded to the bottom of the stem 10. After a semiconductor element 13 is initially secured and connected through a brazing filler 14 to the stem 10 having the poles 11, 12, supersonic bonding system is employed in case that the electrode of the element 13 and the end of the pole are connected. |