| abstract |
PURPOSE: To form a complex pattern with good accuracy by a method wherein a ceramic plate is directly joined to a copper plate by heating without using a metallizing method, and then a required circuit is formed by etching the copper plate. n CONSTITUTION: The copper plates 1 and 3 composed of tough pitch electrolytic copper are arranged by contact on both surfaces of the alumina ceramic plate 5, which are then inserted to a heating furnace at 1,075°C and joined by heating. The substrate 9 is pickled with hydrochloric acid, the pattern is formed by screen printing, and etching treatment is performed with the solution of cupric chloride, etc. Drying is performed by removing the resist and then washing. The heating temperature is set as less than the melting point of copper (1,083°C) and more than the eutectic temperature (1,065°C) of copper-copper oxide. n COPYRIGHT: (C)1984,JPO&Japio |