http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S59126440-A

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filingDate 1983-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06a0e7117e935129978d695bef2ff846
publicationDate 1984-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S59126440-A
titleOfInvention Resin molding material for cleaning mold
abstract PURPOSE: A resin material capable of cleaning easily contaiminated materials in molds of molding of transfer molding, etc. without damaging the molds, containing a thermosetting resin, an inorganic filler having specific particle diameters, and a fibrous filler having specified fiber length, having limited particle diameters of the whole material. n CONSTITUTION: A resin molding material containing (A) a thermosetting resin (e.g., phenolic resin, melamine resin, etc.), (B) an inorganic filler (e.g., CaCO 3 , silica, clay, etc.) having particle diameters passing through 42 meshes Tyler standar sieve, and (C) an fibrous filler (e.g., pulp sawdust, glass fiber, etc.) having ≤0.44mm fiber length, wherein the whole particles pass through 42 meshes Tyler standard sieve, is used for cleaning molds. A blending range is preferably 15W85pts.wt. component A, 10W50pts.wt. component B, and 5W35pts.wt. component C. n EFFECT: When the resin molding material is molded in molds, contaminated materials accumulated in the surfaces of the molds are pushed out by the molding material, and removed easily. n COPYRIGHT: (C)1984,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7537967-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5397498-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5427623-A
priorityDate 1983-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 34.