http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S59113431-A

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filingDate 1982-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cce71cd04e66d6e2ed3c8d7a08d52fbb
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publicationDate 1984-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S59113431-A
titleOfInvention Manufacture of photosensitive resin
abstract PURPOSE:To obtain a photosensitive resin having high mol.wt. and a narrow mol.wt. distribution by reacting dicarboxylic acid having one or two photosensitive unsatd. double bonds adjacent to an aromatic ring with glycol to prepare a polyester precursor having OH gropus and by reacting the precursor with a specified chain extender. CONSTITUTION:Dicarboxylic acid or an ester deriv. thereof represented by formula I or II (where each of R1 and R1' is H, 1-4C alkyl, 1-4C alkoxy, halogen or NO2, and (n) is 1-4) is reacted with glycol to prepare a polyester precursor having OH groups at terminals. The precursor is reacted with one or more kinds of compounds selected from compounds represented by formulae III, IV and V[where each of R3 and R4 is (substituted) aromatic hydrocarbon, and the substituent is CnH2n+1 (n is 1-10), halogen or the like] as a chain extender to manufacture a photosensitive resin. The amount of the chain extender is 0.1- 20wt% of the amount of the precursor. The resin is manufactured without causing gelation. The resin has superior developability and resolution, and it is suitable for use in the manufacture of an integrated circuit or a printing plate.
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Total number of triples: 30.