http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S58215451-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_af77a35ed25c1014a6d781dd275b73f5 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
filingDate | 1982-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5eed5f44338b8535cc76f08f9d8f1675 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fadc91c0970b9dc78481884d3c69f878 |
publicationDate | 1983-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-S58215451-A |
titleOfInvention | Heat-resistant resin molding material |
abstract | PURPOSE: To provide a heat-resistant resin molding material having excellent heat resistance and mechanical characteristics during heating, by blending silica powder with a thermosetting resin obtd. by reacting a bismaleimide compd. with aminophenol. n CONSTITUTION: 25W90wt% (based on the amount of molding material) silica powder is blended with a thermosetting resin obtd. by reacting a bismaleimide of formula I [wherein R 1 is H, alkyl; X is a bivalent group of formula II, III, IV, V or VI (wherein R 2 is H, Cl, alkyl; T is -O-, -CH 2 -, -SO 2 -, -S-S-; m is 1W 6)] with an aminophenol of formula VII (wherein R 3 is H, halogen, alkyl; n is 1, 2). Examples of the bismaleimides are ethylenebismaleimide and 4,4'-diphenyl- methanebismaleimide. Examples of the aminophenols are m-, and p-aminophenol and 2-amino-4-chlorophenol. n COPYRIGHT: (C)1983,JPO&Japio |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S62177033-A |
priorityDate | 1982-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.