http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S5767616-A

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filingDate 1980-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f47dce13c6f6e89e82049b0d86038999
publicationDate 1982-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S5767616-A
titleOfInvention Unsaturated polyester resin composition
abstract PURPOSE: A composition useful for sealing elecric parts, etc. having improved adhesively to metallic parts, low post-molding shrinkage, and improved heat resistance, obtained by adding a copolymerizable monomer and a thermoplastic polymer to a disphenol type unsaturated polyester resin. n CONSTITUTION: (A) 100pts.wt. bisphenol type unsaturated polyester resin (preferably having ≥10mol% bisphenol A skeleton) is blended with (B) 5W200pts.wt. copolymerizable monomer e.g., (t-butyl)styrene, etc., (C) 5W100pts.wt. thermoplastic polymer (e.g., ABS resin, polyethylene terephthalate, etc.), and (D) 0W600pts.wt. unsaturated polyester resin. n EFFECT: Flow properties in molding are increased, and molding of multi-cavity mold of small articles by transfer molding or injection molding is made possible. n COPYRIGHT: (C)1982,JPO&Japio
priorityDate 1980-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 27.