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filingDate 1980-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1982-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S5742711-A
titleOfInvention Heat-resistant photosensitive material
abstract PURPOSE: A photosensitive material excellent in photo-curability, heat resistance, adhesiveness and storage stability, consisting mainly of an unsaturated polyester- imide obtained by reacting p-phenylenediacrylic acid with a specified dihydric alcohol. n CONSTITUTION: An unsaturated polyester-imide, acid value ≤30, is obtained by reacting, with heating, (A) a dihydric alcohol having imido groups in the molecule of the formula, wherein R is an amino alcohol residue, prepared by reacting 1mol of 1,2,3,4,-butanetetracarboxylic acid with 2mol of amino alcohol, with (B) a p- phenylenediacrylic acid (derivative) and, if necessary, (C) other polybasic acids or polyhydric alcohols other than the above components A and B. Then, 100pts.wt. this polyester-imide is mixed with not more than 5pts.wt. photosensitizer, e.g., benzoin, to obtain a photosensitive material. n COPYRIGHT: (C)1982,JPO&Japio
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