| abstract |
PURPOSE: A photosensitive material which has excellent storage stability and is cured well by light to form films excellent in heat resistance and adhesiveness, prepared by reacting a polyhydric alcohol with p-phenylenediacrylic acid and an imido bond-containing dibasic acid. n CONSTITUTION: An unsaturated polyester-imide is prepared by reacting, with stirring, a mixture of (i) p-phenylenediacrylic acid or its derivative and (ii) an imido bond-containing dibasic acid of the formula, wherein R is an amino acid residue, with (iii) an excess of a polyhydric alcohol, e.g., ethylene glycol, and further heating the reaction mixture after distilling off the unreacted alcohol in vacuum. 100pts.wt. above-produced polyester-imide, not more than 5pts.wt. photosensitizer, e.g., benzoin, if necessary, and a small amount of a solvent are mixed to form a photosensitive material. This material is coated on an object and irradiated with light to cure the film. n USE: Electric and electronic protective material, insulating material, solder resist, adhesive, coating material and heat-resistant photoresist for the production of semiconductor elements. n COPYRIGHT: (C)1982,JPO&Japio |