http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S572549-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44f82521bd7b49adba4be2e3e4f3b66a |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
filingDate | 1980-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a670f6273ad14ba5e4c0bf0d5a53bfb |
publicationDate | 1982-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-S572549-A |
titleOfInvention | Semiconductor device and manufacture thereof |
abstract | PURPOSE:To alleviate the mechanical stress of a bump and to reduce the number of working steps by selectively forming a nitrided film on a bonding pad forming part as a bump station and forming a bonding projection and peripheral stepwise recess structure. CONSTITUTION:A plasma nitrided film 1 is selectively formed on a semiconductor substrate. Then, an aluminum is covered on the overall surface, the nitrided film becoming a stepwise bump station and the aluminum around the station are removed, and an aluminum wiring part 4 remains. Then, a Ti-Pt is covered on the nitrided film and its periphery, a gold plating layer 4 is formed, and a bump 6 is bonded. Thus, the bump station is formed in a stepwise structure, a stress can be alleviated, and the number of steps can be reduced. |
priorityDate | 1980-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.