http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S572327-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
filingDate 1980-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfc0c3e619b95c057c874db54d429566
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46358845e20712c7c92ece89c9044354
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98678deb7fd08d57628a6fe4ba20cb59
publicationDate 1982-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S572327-A
titleOfInvention Thermosetting resin composition
abstract PURPOSE: The titled composition having quickly setting properties, capable of providing a cured material having improved heat resistance, flexibility, and electric properties by crosslinking under heating, comprising an ether imide compound and a specific epoxy compound. n CONSTITUTION: (A) 100pts.wt. Ether imide compound, e.g., 2,2-bis[4-(maleimidophenoxy)phenyl]propane, etc. shown by the formula (R 1 WR 4 are H, lower alkyl, lower alkoxy, Cl or Br; R 5 and R 6 are H, methyl, ethyl, trifluoromethyl, trichloro?methyl; D is bifunctional organic group having 2W24C) is blended with (B) 10W 1,000pts.wt. epoxy compound (e.g., glycidyl acrylate, etc.) having both terminal vinyl or terminal allyl group and terminal epoxy group. Preferably 0.01W10wt% based on above-mentioed composition of a polymerization initiator, e.g., benzoyl peroxide, etc. is added to the blend. n COPYRIGHT: (C)1982,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S62157452-U
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priorityDate 1980-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 35.