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filingDate 1981-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76078137972daac6612b847d5a1e34aa
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publicationDate 1982-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S57207642-A
titleOfInvention Polyphenylene oxide resin composition
abstract PURPOSE: To provide the titled composition having excellent flame retardance and low tendency of smoking and bleeding in molding process, without lowering the heat deformation temperature, by compounding a specific resorcin diphosphate compound to a polyphenylene oxide resin. n CONSTITUTION: A polyhenylene oxide resin is compounded with a resorcin diphosphate compound of formula (R is H or methyl), e.g. diphenyl dicresyl resorcin diphosphate, by kneading under heating. The amount of the additive is 0.1W30wt%, preferably 1W15wt% of the whole composition. It is effective even to a composition compounded with a styrene resin for the purpose of improving the moldability. n COPYRIGHT: (C)1982,JPO&Japio
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priorityDate 1981-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 42.