http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S57192423-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| filingDate | 1981-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98678deb7fd08d57628a6fe4ba20cb59 |
| publicationDate | 1982-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S57192423-A |
| titleOfInvention | Thermosetting resin composition |
| abstract | PURPOSE: A thermosetting resin composition having improved heat resistance and flexiblity and unharmed moldability, comprising a polyepoxy compound, a polyisocyanate compound and a polyimide compound. n CONSTITUTION: A thermosetting resin composition comprising a polyepoxy compound, a polyisocyanate compound and a polyimide compound represented by the formula, wherein R 1 is a bivalent organic group having an aliphatic unsaturated bond, and R 2 is a bivalent organic group. As the polyepoxy compound, there is a glycidyl ether of bisphenol A or butadiene diepoxide. As the polyisocyanate compound, there can be mentioned methane diisocyanate or butane 1,1-diisocyanate. As the polyimide compound, there can be mentioned N,N'-ethylenebismaleimide or N,N'-m-phenylenebismaleimide. n COPYRIGHT: (C)1982,JPO&Japio |
| priorityDate | 1981-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.