http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S57192047-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76889
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-43
filingDate 1981-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84d65ac25583e0f63557e2f0d32425ed
publicationDate 1982-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S57192047-A
titleOfInvention Wiring layer in semiconductor device and manufacture thereof
abstract PURPOSE:To obtain ohmic contact in both P type and N type regions and to avoid the formation of an unnecessary diode by forming the wiring layer in the semiconductor device by metal silicide. CONSTITUTION:A platinum layer 8 is formed on the entire surface after plasma ethcing. The thickness of the layer is made thicker than the thickness of a polysilicon layer 7. The reason why is that the platinum silicide layer must reach the P type region 2 and the N type region 3 in holes 5 and 6 so as to form the ohmic contact at the next step when the platinum and the polysilicon are reacted to form the platinum silicide by heat treatment. By this heat treatment, the polysilicon layer 7 and the platinum 8 are reacted, but the part other than the layer 7 is left as the platinum. Then the platinum is removed in aqua regia, the unreacted platinum layer is removed, and only the platinum silicide layer remains.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07221096-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S62120354-U
priorityDate 1981-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23939
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID62687
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID25199861
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458431511
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419578708
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452260893
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID454705035

Total number of triples: 25.