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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-38
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filingDate 1980-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff0181cebe1686ffa4108c8234081a9c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb48976c91acaf00f5aa58c9da7840a4
publicationDate 1982-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S57167-A
titleOfInvention Electrically conductive resin composition for electroplating
abstract PURPOSE: The titled resin composition capable of directly forming electro-plate on a molded product of a thermoplastic resin not necessitating preliminary etching or chemical plating, which is obtd. by kneading an electrically conductive resin and a thiourea compd. n CONSTITUTION: 1W10pts.wt. Thiourea or mono-substituted thiourea compd. (e.g., monomethyl thiourea, monophenyl thiourea or p-phenylene-dithiourea) is added to 100pts.wt. electrically conductive resin obtd. by mixing a thermoplastic resin such as a polyethylene, polypropylene, polyester or polyamide resin with an electrically conductive material such as carbon black, graphite or a metal powder, and the resulting mixt. is kneaded by use of an extruder, etc. to obtain the purpose resin composition. It is preferable to mix said electrically conductive material in such a proportion as to give the electrically conductive resin composition for electroplating of specific volume resistance ≤500Ω.cm. n COPYRIGHT: (C)1982,JPO&Japio
priorityDate 1980-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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