http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S57164-A

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filingDate 1980-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14f1ffb88209a4d9672cc1fae41858c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df4aa826e575e939b57fef6d6c015704
publicationDate 1982-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S57164-A
titleOfInvention Method of molding aromatic polyamide resin
abstract PURPOSE:To obtain an arom. polyamide resin molded product with improved mechanical strength, by the pressure molding of an arom. polyamide powder compounded with an oxazoline compd. in a metal mold followed by heating. CONSTITUTION:A powdered polyamide composition obtd. by compounding an arom. polyamide (A) with 0.01-10wt% based on component (A), compound (B) of formula I (wherein D is a divalent org. group.; n is 0 or 1; X is a divalent org. group in which a ring structure of formula II forms a five-or six-membered ring), is subjected to pressure molding in a metal mold to obtain a prelinminary molded product. Then the preliminary molded product is heated at a temp. lower than the m.p. of the aromatic polyamide (A). The compd. of the formula I, being particularly highly reactive with a -COOH group, reacts with the terminal group of the arom. polyamide even in a solid state, which can efficiently increase the degree of polymerization of the arom. polyamide.
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Total number of triples: 25.