http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S57130765-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d839c4c3670323e7615716a36fb3a355
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-19
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-19
filingDate 1981-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eccc3580cf5b4db26d0aac3dbef67908
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d04cd1a90ecbd86395c0d722e38580d
publicationDate 1982-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S57130765-A
titleOfInvention Soldering method for surface treated steel plate
abstract PURPOSE:To execute firm soldering and to improve reliability by shearing a slit, etc. to the soldering position of a steel plate and soldering the same. CONSTITUTION:In the case of soldering a substrate 1 of a surface treated steel plate, solder is difficult to stick on its surface and therefore a slit 2 is formed to the substrate 1 by shearing with a press or the like. An electric part is soldered in such a way that solder 4 is melt stuck to the shorn surface of the slit 2, that is, the blank material exposed surface of the steel. Thereby, the solder 4 is melt stuck firmly to the shorn surface and the electric part is disposed surely to the substrate 1. The firm soldering work is executed by this with, for example, a zinc plated steel plate of poor melt-sticking property of solder.
priorityDate 1981-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 21.