| abstract |
PURPOSE: To prepare the titled composition having low loss in weight on curing and giving a cured product with excellent heat resistance, by compounding a specific polymerizable compound with an unsaturated polyester, an epoxy(meth)acrylate, etc. n CONSTITUTION: A composition composed mainly of (A) a compound of formula (R 1 and R 2 are H or methyl) and (B) an unsaturated polyester (pref. containing tris(2-hydroxyethyl)isocyanurate as one component) and/or an epoxy(meth)acrylate (pref. having a bisphenol skeleton). The amount of the component (A) is pref. 30W80wt% of the curable resin composition. n COPYRIGHT: (C)1981,JPO&Japio |