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filingDate 1979-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b642685fcfe1985d1dd924f3165eac26
publicationDate 1981-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S5647442-A
titleOfInvention Heat-stabilized synthetic resin composition
abstract PURPOSE: To improve the heat resistance of a vinyl chloride polymer maintaining the other characteristics of the polymer, by adding a small amount of an organometallic compound such as epoxidized stearic acid salt to the vinyl chloride polymer. n CONSTITUTION: The objective composition is obtained by compounding (A) 100pts.wt. of a vinyl chloride polymer or a copolymer of vinyl chloride and other synthetic resin monomer with (B) 0.01W3.0pts.wt. of a heat-stabilizer comprising a metal compound of formula I (R is an unsaturated hydrocarbon group of formula CH 3 C n H 2n-2m ; n is 10W22; m is 0 or 1; M is Na, Ca, Ba, Zn, Cd, Pb, Sn, etc.), e.g. the compound of formula II, etc. The compound of formula II is prepared e.g. by reacting methyl oleate with aqueous hydrogen peroxide, sulfuric acid, and formic acid to obtain a compound composed mainly of epoxidized stearic acid methyl ester, and subjecting the compound to saponification and double decomposition reaction. n COPYRIGHT: (C)1981,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002020505-A
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